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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 1/4
HM882
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM882 is suited for the output stage of 0.75W audio, voltage regulator, and relay driver.
Absolute Maximum Ratings
SOT-89
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................ 0.6 W (Note1) Total Power Dissipation (Ta=25C) ............................................................................... 2 W (Note2) Total Power Dissipation (Tc=25C)............................................................................ 1.3 W (Note1) Total Power Dissipation (Tc=25C) ............................................................................ 3.4 W (Note2) * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 70 V VCEO Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current............................................................................................................... 3 A
Thermal Characteristic
Characteristic Thermal Resistance, junction to ambient Thermal Resistance, junction to ambient (Note2) Thermal Resistance, junction to case (Note1) Thermal Resistance, junction to case (Note2)
Note1: When tested in free air condition, without heat sinking. Note2: When mounted on a 40X40X1mm ceramic board.
(Note1)
Symbol Rja Rja Rjc Rjc
Max. 208 62.5 86 36.8
Unit
o o
C/W C/W o C/W o C/W
HM882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 100 Typ. 90 45 Max. 1 1 0.5 2 500 Unit V V V uA uA V V
Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 2/4
Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=3V, IB=0 IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz IE=0,VCB=10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz pF
Classification Of hFE2
Rank Range Q 100-200 P 160-320 E 250-500
HM882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 10
Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 3/4
Saturation Voltage & Collector Current
Saturation Voltage (mV)
1 VBE(sat) @ IC=10IB
hFE
VCE=2V
0.1
VCE(s at) @ IC=10IB 100 0.01 0.1 1 10 100 1000 10000 0.01 0.1 1 10 100 1000 10000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
1000
Cutoff Frequency & Collector Current
Cob
Cutoff Frequency (MHz)
Capacitance (pF)
VCE=5V
10 0.1 1 10 100
100 1 10 100 1000
Reverse-Biased Voltage (V)
Collector Current (mA)
Safe Operating Area
10000 PT=1ms
Collector Current-IC (mA)
1000
PT=100ms
PT=1s
100
10 1 10 100
Forward Voltage-VCE (V)
HM882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking:
Spec. No. : HE9514 Issued Date : 1997.06.05 Revised Date : 2003.01.10 Page No. : 4/4
C
H
Date Code 882 Laser Marking HM
B 1 E F G A 2 3
D
Style: Pin 1.Base 2.Collector 3.Emitter
I
3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M
*: Typical
DIM A B C D E
Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201
Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51
DIM F G H I
Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161
Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM882
HSMC Product Specification


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